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1

Handbook of 3D Integration (Design, Test, and Thermal Management) || Physical Design Flow for 3D/CoWoS® Stacked ICs

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 1.70 MB

english, 2019

2

Handbook of 3D Integration (Design, Test, and Thermal Management) || IEEE Std P1838: 3D Test Access Standard Under Development

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 1.34 MB

english, 2019

3

Handbook of 3D Integration (Design, Test, and Thermal Management) || 3D Stacked DRAM Memories

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 3.36 MB

english, 2019

4

Handbook of 3D Integration (Design, Test, and Thermal Management) || 3D Design-for-Test Architecture

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 2.02 MB

english, 2019

5

Handbook of 3D Integration (Design, Test, and Thermal Management) || Multiphysics Challenges and Solutions for the Design of Heterogeneous 3D Integrated System

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 936 KB

english, 2019

6

Handbook of 3D Integration (Design, Test, and Thermal Management) || Electronic Design Automation for 3D

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 273 KB

english, 2019

7

SABSA: SWITCHING-ACTIVITY-BASED STATE ASSIGNMENT

WASHABAUGH, SCOTT, FRANZON, PAUL D., NAGLE, H. TROY

Journal:

International Journal of High Speed Electronics and Systems

Year:

1994

Language:

english

File:

PDF, 420 KB

english, 1994

8

Self-Evolution Cascade Deep Learning Model for High-Speed Receiver Adaptation

Li, Bowen, Jiao, Brandon, Chou, Chih-Hsun, Mayder, Romi, Franzon, Paul

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2020

File:

PDF, 3.01 MB

2020

9

Fundamental Interconnection Issues

Hatamian, Mehdi, Hornak, Lawrence A., Little, Trevor E., Tewksbury, Stuart K., Franzon, Paul

Journal:

AT&T Technical Journal

Year:

1987

Language:

english

File:

PDF, 5.37 MB

english, 1987

10

Handbook of 3D Integration (Design, Test, and Thermal Management) || Test and Debug Strategy for TSMC CoWoS ® Stacking Process-Based Heterogeneous 3D-IC: A Silicon Study

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 1.83 MB

english, 2019

11

[IEEE 2016 IEEE International Conference on RFID (RFID) - Orlando, FL, USA (2016.5.3-2016.5.5)] 2016 IEEE International Conference on RFID (RFID) - Design of a rectifier-free UHF Gen-2 compatible RFID Tag using RF-only logic

Zhao, Wenxu, Bhanushali, Kirti, Franzon, Paul

Year:

2016

Language:

english

File:

PDF, 975 KB

english, 2016

12

Millimeter-Scale True 3-D Antenna-in-Package Structures for Near-Field Power Transfer

Gadfort, Peter, Franzon, Paul D.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 2.52 MB

english, 2014

13

Thermal Pathfinding for 3-D ICs

Priyadarshi, Shivam, Davis, W. Rhett, Steer, Michael B., Franzon, Paul D.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 2.79 MB

english, 2014

14

Handbook of 3D Integration (Design, Test, and Thermal Management) || Pre-Bond Testing Through Direct Probing of Large-Array Fine-Pitch Micro-Bumps*

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 1.56 MB

english, 2019

15

[IEEE 2007 IEEE International Symposium on Circuits and Systems - New Orleans, LA, USA (2007.05.27-2007.05.30)] 2007 IEEE International Symposium on Circuits and Systems - Hardware Architecture of a Parallel Pattern Matching Engine

Yadav, Meeta, Venkatachaliah, Ashwini, Franzon, Paul D.

Year:

2007

Language:

english

File:

PDF, 791 KB

english, 2007

16

Handbook of 3D Integration (Design, Test, and Thermal Management) || Optimization of Test-Access Architectures and Test Scheduling for 3D ICs

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 571 KB

english, 2019

17

Application Exploration for 3-D Integrated Circuits: TCAM, FIFO, and FFT Case Studies

Davis, W. Rhett, Oh, Eun Chu, Sule, Ambarish M., Franzon, Paul D.

Journal:

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Year:

2009

Language:

english

File:

PDF, 1.32 MB

english, 2009

18

[IEEE 2013 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2013.10.2-2013.10.4)] 2013 IEEE International 3D Systems Integration Conference (3DIC) - Face-to-face bus design with built-in self-test in 3D ICs

Zhang, Zhenqian, Noia, Brandon, Chakrabarty, Krishnendu, Franzon, Paul

Year:

2013

Language:

english

File:

PDF, 402 KB

english, 2013

19

[IEEE 2019 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2019.10.8-2019.10.10)] 2019 International 3D Systems Integration Conference (3DIC) - Vertical Stack Thermal Characterization of Heterogeneous Integration and Packages

Harris, T. Robert, Davis, W. Rhett, Lipa, Steven, Pitts, W. Shepherd, Franzon, Paul D.

Year:

2019

File:

PDF, 802 KB

2019

20

Handbook of 3D Integration (Design, Test, and Thermal Management) || Thermal Isolation and Cooling Technologies for Heterogeneous 3D- and 2.5D-ICs

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 1.63 MB

english, 2019

21

Handbook of 3D Integration (Design, Test, and Thermal Management) || On the Thermal Management of 3D-ICs: From Backside to Volumetric Heat Removal

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 1.90 MB

english, 2019

22

Inductively Coupled Connectors and Sockets for Multi-Gb/s Pulse Signaling

Chandrasekar, Karthik, Wilson, John, Erickson, Evan, Feng, Zhiping, Xu, Jian, Mick, Stephen, Franzon, Paul

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.18 MB

english, 2008

23

Handbook of 3D Integration (Design, Test, and Thermal Management) || Ultrafine Pitch 3D Stacked Integrated Circuits: Technology, Design Enablement, and Application

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 525 KB

english, 2019

24

[IEEE 2012 IEEE Custom Integrated Circuits Conference - CICC 2012 - San Jose, CA, USA (2012.09.9-2012.09.12)] Proceedings of the IEEE 2012 Custom Integrated Circuits Conference - A 10.35 mW/GFlop stacked SAR DSP unit using fine-grain partitioned 3D integration

Thorolfsson, Thorlindur, Lipa, Steve, Franzon, Paul D.

Year:

2012

Language:

english

File:

PDF, 2.86 MB

english, 2012

25

Handbook of 3D Integration (Design, Test, and Thermal Management) || Power Delivery Network and Integrity in 3D-IC Chips

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 735 KB

english, 2019

26

Handbook of 3D Integration (Design, Test, and Thermal Management) || Front Matter

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 178 KB

english, 2019

27

[IEEE 2012 IEEE Subthreshold Microelectronics Conference (SubVT) - Waltham, MA, USA (2012.10.9-2012.10.10)] 2012 IEEE Subthreshold Microelectronics Conference (SubVT) - An analysis of subthreshold SRAM bitcells for operation in low power RF-only technologies

Ledford, Joshua, Gadfort, Peter, Franzon, Paul D.

Year:

2012

Language:

english

File:

PDF, 234 KB

english, 2012

28

[IEEE 2016 29th IEEE International System-on-Chip Conference (SOCC) - Seattle, WA, USA (2016.9.6-2016.9.9)] 2016 29th IEEE International System-on-Chip Conference (SOCC) - Hardware implementation of Hierarchical Temporal Memory algorithm

Li, Weifu, Franzon, Paul

Year:

2016

Language:

english

File:

PDF, 495 KB

english, 2016

29

Handbook of 3D Integration (Design, Test, and Thermal Management) || Index

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 90 KB

english, 2019

30

Handbook of 3D Integration (Design, Test, and Thermal Management) || Passive and Active Thermal Technologies: Modeling and Evaluation

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 3.09 MB

english, 2019

31

Improving Behavioral IO Buffer Modeling Based on IBIS

Varma, Ambrish K., Steer, Michael, Franzon, Paul D.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 1.45 MB

english, 2008

32

Foreword Special Section on Electrical Performance Analysis and Simulation of Interconnects, Packages and Devices Composing Electronic Systems for High-Performance Applications

Canavero, Flavio, Franzon, Paul D.

Journal:

IEEE Transactions on Advanced Packaging

Year:

2008

Language:

english

File:

PDF, 303 KB

english, 2008

33

Handbook of 3D Integration (Design, Test, and Thermal Management) || Thermal Modeling and Model Validation for 3D Stacked ICs

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 1.24 MB

english, 2019

34

Handbook of 3D Integration (Design, Test, and Thermal Management) || Design and CAD Solutions for Cooling and Power Delivery for Monolithic 3D-ICs

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 1.32 MB

english, 2019

35

[IEEE 2013 IEEE International Symposium on Circuits and Systems (ISCAS) - Beijing (2013.5.19-2013.5.23)] 2013 IEEE International Symposium on Circuits and Systems (ISCAS2013) - Exploring early design tradeoffs in 3DIC

Franzon, Paul D., Priyadarshi, Shivam, Lipa, Steve, Davis, W. Rhett, Thorolfsson, Thor

Year:

2013

Language:

english

File:

PDF, 678 KB

english, 2013

36

Surrogate-Model-Based Analysis of Analog Circuits—Part II: Reliability Analysis

Yelten, Mustafa Berke, Franzon, Paul D., Steer, Michael B.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2011

Language:

english

File:

PDF, 594 KB

english, 2011

37

[IEEE 2007 IEEE International Symposium on Circuits and Systems - New Orleans, LA, USA (2007.05.27-2007.05.30)] 2007 IEEE International Symposium on Circuits and Systems - Flexible Low Power Probability Density Estimation Unit For Speech Recognition

Pazhayaveetil, Ullas, Chandra, Dhruba, Franzon, Paul

Year:

2007

Language:

english

File:

PDF, 282 KB

english, 2007

38

Adaptive and Reliable Clock Distribution Design for 3-D Integrated Circuits

Xi Chen,, Ting Zhu,, Davis, William Rhett, Franzon, Paul D.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 1.89 MB

english, 2014

39

[IEEE 2015 IEEE Custom Integrated Circuits Conference - CICC 2015 - San Jose, CA, USA (2015.9.28-2015.9.30)] 2015 IEEE Custom Integrated Circuits Conference (CICC) - Computing in 3D

Franzon, Paul, Rotenberg, Eric, Tuck, James, Davis, W. Rhett, Zhou, Huiyang, Schabel, Joshua, Zhang, Zhenquian, Dwiel, J. Brandon, Forbes, Elliott, Huh, Joonmoo, Lipa, Steve

Year:

2015

File:

PDF, 754 KB

2015

40

[IEEE 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) - Raleigh, NC, USA (2016.6.13-2016.6.15)] 2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) - Novel packaging and thermal measurement for 3D heterogeneous stacks

Harris, T. Robert, Davis, W. Rhett, Franzon, Paul

Year:

2016

Language:

english

File:

PDF, 5.88 MB

english, 2016

41

Handbook of 3D Integration (Design, Test, and Thermal Management) || Cost Modeling for 2.5D and 3D Stacked ICs

Franzon, Paul D., Jan Marinissen, Erik, S. Bakir, Muhannad

Year:

2019

Language:

english

File:

PDF, 645 KB

english, 2019

42

[IEEE 2016 IEEE 25th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - San Diego, CA, USA (2016.10.23-2016.10.26)] 2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS) - Machine learning in physical design

Li, Bowen, Franzon, Paul D.

Year:

2016

Language:

english

File:

PDF, 179 KB

english, 2016

43

Asymmetric Transformer Design With Multiband Frequency Response for Simultaneous Power and Data Transfer

Zannat, Nazia, Franzon, Paul D.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2020

File:

PDF, 4.38 MB

2020

44

Load characterization of high displacement piezoelectric actuators with various end conditions

James Mulling, Tim Usher, Brian Dessent, Jeremy Palmer, Paul Franzon, Eddie Grant, Angus Kingon

Journal:

Sensors and Actuators A: Physical

Year:

2001

Language:

english

File:

PDF, 135 KB

english, 2001

45

Analog Negative-Bias-Temperature-Instability Monitoring Circuit

Yelten, Mustafa Berke, Franzon, Paul D., Steer, Michael B.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2012

Language:

english

File:

PDF, 208 KB

english, 2012

46

SPIE Proceedings [SPIE International Symposium on Microelectronics and MEMS - Adelaide, Australia (Monday 17 December 2001)] Design, Characterization, and Packaging for MEMS and Microelectronics II - Coupling and quality factors in RFID

Cole, Peter H., Franzon, Paul D., Malshe, Ajay P., Tay, Francis E.

Year:

2001

Language:

english

File:

PDF, 201 KB

english, 2001

47

[IEEE 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) - Portland, OR, USA (2009.10.19-2009.10.21)] 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems - Multi-bit fractional equalization for multi-Gb/s inductively coupled connectors

Erickson, Evan, Wilson, John, Chandrasekar, Karthik, Franzon, Paul D.

Year:

2009

Language:

english

File:

PDF, 663 KB

english, 2009

48

Multimode High-Density Link Design Methodology and Implementation

Yan, Zhuo, Aygun, Kemal, Braunisch, Henning, Franzon, Paul D.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2016

Language:

english

File:

PDF, 3.77 MB

english, 2016

49

A Generic and Scalable Architecture for a Large Acoustic Model and Large Vocabulary Speech Recognition Accelerator Using Logic on Memory

Bapat, Ojas A., Franzon, Paul D., Fastow, Richard M.

Journal:

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Year:

2014

Language:

english

File:

PDF, 2.87 MB

english, 2014

50

[IEEE 2012 IEEE Subthreshold Microelectronics Conference (SubVT) - Waltham, MA, USA (2012.10.9-2012.10.10)] 2012 IEEE Subthreshold Microelectronics Conference (SubVT) - Near threshold RF-only analog to digital converter

Gadfort, Peter, Franzon, Paul D.

Year:

2012

Language:

english

File:

PDF, 215 KB

english, 2012

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